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Metallographic cross-sectioning is the technique, during material characterization or failure mode analysis, for exposing an internal plane of interest in an object or package for examination. Physically destructive in nature, cross-sectioning requires encapsulation of the specimen in plastic to provide support, stability, and protection.

 

 

Cross-section of solder dipped IC lead

Cross-sectioned solder bumps on PCB

 

 

Also known as micro-sectioning, cross-sectioning begins with the preparation of the sample. This sample preparation step is usually followed by the mounting, sawing, grinding, polishing, and staining of the specimen. At the completion of these processes, the plane of interest has been made ready for optical and/or scanning electron microscopy.

 

Braze/Solder bond, solder phases, voids, diffusion.

 

 

Braze/Solder bond, solder phases, voids, diffusion.