Issue No. 29 - (2/11/10 - Real Time X-Ray Imaging)

 


Real Time X-Ray Imaging   

Silicon Cert Laboratories (SCL) is pleased to announce Real Time X-Ray imaging as its latest in-house analytical services offering. X-Ray imaging is the nondestructive, internal examination of devices and packages. Samples ranging from low-density molded packages to higher-density metal can devices as well as circuit boards can be viewed with a high degree of detail.

Applications for this technology are wide-ranging in that samples from a variety of industries can be examined. Within the microelectronics industry, for example, X-ray imaging serves to detect defects such as wirebond problems, solder ball voids, package construction, and die attach voids. Real Time X-Ray imaging is often an important technique used in conjunction with other analytical processes. It is also becoming increasingly important as one of the initial steps when performing counterfeit detection.



SCL’s FeinFocus X-ray imaging system can inspect samples in real time through five axis of movement. This allows for an immediate and thorough analysis of structures with varying densities. It operates on the principle of dissimilar transmission of X-Rays through different density materials creating an image of various contrasts. The filament within the system produces an electron beam used to excite a target into producing X-Rays. The X-Ray emissions are then directed to and transmitted through the sample. The resultant transmitted X-Rays are collected by a detector, translated into electric signals, amplified, and transformed into an X-Ray image.

X-Ray   X-Ray


Reliability Testing
SCL, as a leading reliability testing company with many years of experience, can economically perform other reliability tests, including:

  • Mechanical Shock
  • Vibration
  • Accelerated Bias Aging
  • Random Vibration
  • Thermal Shock
  • Temperature Cycling
  • Moisture Sensitivity Level (MSL)
  • High Temperature Storage
  • Preconditioning
  • Damp Heat / THB
  • PIND
  • Cyclic Moisture
  • Resistance to Solvents
  • Fine & Gross Leak Detect
  • Tin Whisker Studies
  • Low Temperature Storage
  • Fiber Integrity
  • Autoclave
  • HAST
  • Solderability
  • Scanning Electron Microscopy (SEM)
  • Optical Microscopy
  • Auger Electron Spectroscopy (AES)
  • Precision Cross-Sectioning
  • Package Decapsulation
  • Acoustical Microscopy (CSAM)
  • Material & Contamination Analysis
  • Energy Dispersive Spectroscopy (EDS)