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Electro-Thermally Induced Gate Leakage is a failure mode introduced
in high temperature, high electric field environments such
as in an automotive engine compartment. It occurs in plastic
encapsulated bipolar and MOS technologies, and adversely affects
the performance and reliability of an IC. The failure mode
is reversible with a high temperature bake without bias. A
standardized test (AEC-Q100-006) has been developed to test
the sensitivity of an IC to this trapped-charge phenomenon.
Silicon Cert is pleased to announce in-house gate leakage
testing capability, as it becomes one of the few test laboratories
within the USA to offer this test.
For more information call us at 610-939-9500.
Reliability Testing
SCL, as a leading reliability testing company with many years
of experience, can economically perform Random Vibration Testing
as well as other reliability tests, including:
- Mechanical Shock
- Vibration
- Accelerated Bias Aging
- Autoclave
- Temperature Cycling
- Tin Whisker Studies
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- Damp Heat / THB
- Cyclic Moisture
- SAM Analysis
- Thermal Shock
- Fine & Gross Leak Detect
- MSL and Preconditioning
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- Centrifuge
- PIND
- Cross-sectioning
- HAST
- SEM analysis
- IC Decapsulation
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